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High precision intelligent temperature transmitter module launched in China - chip level integration, 4-20mA/RS485 outpu

2025-08-20
Latest company news about High precision intelligent temperature transmitter module launched in China - chip level integration, 4-20mA/RS485 outpu
High precision intelligent temperature transmitter module launched in China - chip level integration, 4-20mA/RS485 output, core component of Industry 4.0!

Chip level temperature transmission module is globally launched, ushering in a precision measurement and control revolution in the industrial Internet of Things In the wave of Industry 4.0 and intelligent manufacturing, high-precision temperature measurement and control has become the core bottleneck of equipment intelligence. As an industrial sensor chip level solution provider, [brand name] has officially released a high-precision intelligent temperature transmitter module. This product uses independently developed ASIC chips to achieve ± 0.1% measurement accuracy and multi protocol output, providing the ultimate embedded temperature measurement and control solution for global OEM customers.

Three major technological breakthroughs lead industry transformation
  1. Chip level integration technology
    • Independently developed ASIC chip (size 15 * 15mm)
    • ± 0.1% ultra-high precision (full range -200 ℃~+850 ℃)
    • 0.01 ℃ resolution (24 bit ADC sampling)
  2. Multi protocol compatible architecture
    • 4-20mA/HART/RS485 the third mock examination output
    • Modbus RTU protocol built-in (supports custom registers)
    • Wireless LORA/WiFi module optional (transmission distance 1km)
  3. Military grade reliability
    • -Wide temperature operation from 40 ℃ to+105 ℃ (industrial grade components)
    • EMC Level 4 protection (anti-interference strength>4000V)
    • 5-year lifespan guarantee (MTBF>100000 hours)
Embedded application scenarios
Intelligent equipment field
  • Injection molding machine temperature control system (replacing traditional temperature control meters)
  • Industrial oven integration (saving 90% of wiring costs)
  • Laser equipment cooling monitoring (response time<50ms)
new energy industry
  • Energy storage battery temperature management (± 0.2 ℃ consistency)
  • Photovoltaic inverter heat dissipation monitoring (IP67 protection version)
  • Charging pile cable temperature protection (CAN bus output)
Smart Agriculture
  • Livestock and poultry house environmental control system (moisture-proof and ammonia corrosion resistant)
  • Grain silo temperature monitoring (LORA wireless network)
  • Aquaculture constant temperature control (316L stainless steel probe)
Customer Value Data
A certain injection molding machine manufacturer:
  • Reduce module costs by 40% (compared to discrete solutions)
  • 60% reduction in failure rate (integrated design)
New energy enterprises:
  • UL/CE certification (assisting in product export)
  • Development cycle shortened by 70% (plug and play)
products
NEWS DETAILS
High precision intelligent temperature transmitter module launched in China - chip level integration, 4-20mA/RS485 outpu
2025-08-20
Latest company news about High precision intelligent temperature transmitter module launched in China - chip level integration, 4-20mA/RS485 outpu
High precision intelligent temperature transmitter module launched in China - chip level integration, 4-20mA/RS485 output, core component of Industry 4.0!

Chip level temperature transmission module is globally launched, ushering in a precision measurement and control revolution in the industrial Internet of Things In the wave of Industry 4.0 and intelligent manufacturing, high-precision temperature measurement and control has become the core bottleneck of equipment intelligence. As an industrial sensor chip level solution provider, [brand name] has officially released a high-precision intelligent temperature transmitter module. This product uses independently developed ASIC chips to achieve ± 0.1% measurement accuracy and multi protocol output, providing the ultimate embedded temperature measurement and control solution for global OEM customers.

Three major technological breakthroughs lead industry transformation
  1. Chip level integration technology
    • Independently developed ASIC chip (size 15 * 15mm)
    • ± 0.1% ultra-high precision (full range -200 ℃~+850 ℃)
    • 0.01 ℃ resolution (24 bit ADC sampling)
  2. Multi protocol compatible architecture
    • 4-20mA/HART/RS485 the third mock examination output
    • Modbus RTU protocol built-in (supports custom registers)
    • Wireless LORA/WiFi module optional (transmission distance 1km)
  3. Military grade reliability
    • -Wide temperature operation from 40 ℃ to+105 ℃ (industrial grade components)
    • EMC Level 4 protection (anti-interference strength>4000V)
    • 5-year lifespan guarantee (MTBF>100000 hours)
Embedded application scenarios
Intelligent equipment field
  • Injection molding machine temperature control system (replacing traditional temperature control meters)
  • Industrial oven integration (saving 90% of wiring costs)
  • Laser equipment cooling monitoring (response time<50ms)
new energy industry
  • Energy storage battery temperature management (± 0.2 ℃ consistency)
  • Photovoltaic inverter heat dissipation monitoring (IP67 protection version)
  • Charging pile cable temperature protection (CAN bus output)
Smart Agriculture
  • Livestock and poultry house environmental control system (moisture-proof and ammonia corrosion resistant)
  • Grain silo temperature monitoring (LORA wireless network)
  • Aquaculture constant temperature control (316L stainless steel probe)
Customer Value Data
A certain injection molding machine manufacturer:
  • Reduce module costs by 40% (compared to discrete solutions)
  • 60% reduction in failure rate (integrated design)
New energy enterprises:
  • UL/CE certification (assisting in product export)
  • Development cycle shortened by 70% (plug and play)
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